LTC2230/LTC2231

27

22301p

UP Package

64-Lead Plastic QFN (9mm × 9mm)

(Reference LTC DWG # 05-08-1705)

PACKAGE DESCRIPTIO

9 .00 ± 0.10

(4 SIDES)

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE

MO-220 VARIATION WNJR-5

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE

DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT,

SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

4. EXPOSED PAD SHALL BE SOLDER PLATED

5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 TOP MARK

(SEE NOTE 5)

0.40 ± 0.10

64

63

1

2

BOTTOM VIEW—EXPOSED PAD

7.15 ± 0.10

(4-SIDES)

0.75 ± 0.05

R = 0.115

TYP

0.25 ± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UP64) QFN 0903

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70 ±0.05

7.15 ±0.05

(4 SIDES)

8.10 ±0.05 9.50 ±0.05

0.25 ±0.05

0.50 BSC

PACKAGE OUTLINE

PIN 1

CHAMFER

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.