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© ANPEC Electronics Corp.

Rev . A. 3 - Nov . , 2 0 1 7

APX9 1 5 1

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Symbol

Param eter

Rating

Unit

VDD Pin S upply Vo ltage (VDD to GND)

-0 .3 to 7

V

Output P in (OUT1, OUT2) O utp ut Voltage

-0 .3 to 7

V

Output P in (OUT1, OUT2) Maximum Output Current – Continuo us

Hold

500

1000

mA

FG Pin O utput S ink Cur rent

20

mA

FG Pin O utput Voltage

-0 .3 to 7

V

Maximum Junction Temp erature

150

Storag e Temp erature

-65 to 15 0

Maximum Lea d Soldering Temperature , 10 Seconds

260

The rm a l Ch ar a ct er ist ics

S ymbol

P arame ter

Typical Va lue

Unit

Thermal Resistance-Junction to Am bient

(Note 2)

TSO T-23-6F

240

TSO T-23-6F

520

mW

Re com m e n de d Ope r a t ion Con dit ion s

Symbol

Parameter

Range

Unit

VDD Supply Voltage

1.8 to 6

V

Operating Ambient Temperature

-40 to 105

Junction Temperature

-40 to 125

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Note 2 : The maximum allowable power dissipation at any T

Exceeding the maximum allowable power dissipation will result in excessive die temperature.