ADV7481

Data Sheet

Rev. 0 | Page 22 of 22

OUTLINE DIMENSIONS

Figure 18. 100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-100-4)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADV7481WBBCZ

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

ADV7481WBBCZ-RL

−40°C to +85°C

100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-100-4

purchase any components with internal HDCP keys

AUTOMOTIVE PRODUCTS

The ADV7481W models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.

9.10

9.00 SQ

8.90

7.20

BSC SQ

0.50

0.45

0.40

*COMPLIANT TO JEDEC STANDARDS MO-275-DDAB-1

WITH THE EXCEPTION TO PACKAGE HEIGHT

COPLANARITY

0.12

0.26

REF

A

B

C

D

E

F

G

H

J

K

7

6

3

2

1

5

4

BALL DIAMETER

0.80

BSC

0.90

REF

DETAIL A

A1 BALL

CORNER

A1 BALL

CORNER

DETAIL A

BOTTOM VIEW

TOP VIEW

SEATING

PLANE

*1.400

1.253

1.173

0.975

0.910

0.845

0.383

0.343

0.303

8

9

10

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registered trademarks are the property of their respective owners.

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