© 2004 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSAV430 • Rev. 1.0.2

9

0.65

4.4±0.1

MTC16rev4

0.11

4.55

5.00

5.00±0.10

12°

7.35

4.45

1.45

5.90

Figure 17. 16-Lead, Thin Shrink Small Outline Package (TSSOP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging.

For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:

http://www.fairchildsemi.com/products/analog/pdf/tssop16_tr.pdf.