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TC1268 Datasheet(PDF) 6 Page - Microchip Technology

Part # TC1268
Description  500mA Fixed Output, Fast Response CMOS LDO with Shutdown
PDF  12 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC1268 Datasheet(HTML) 6 Page - Microchip Technology

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TC1268
DS21379B-page 6
© 2002 Microchip Technology Inc.
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated
thermal
protection
circuitry
shuts
the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (
θJA).
EQUATION 4-2:
Table 4-1 shows various values of
θJA for the TC1268
package.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1268 IN
8-PIN SOIC PACKAGE
*Pin 2 is ground. Device is mounted on topside.
Equation 4-1
can
be
used
in
conjunction
with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
= 3.3V ± 10%
VOUTMIN = 2.5V ± 0.5%
ILOADMAX = 275mA
TJMAX
= 125°C
TAMAX
=95°C
θJA
=60°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX –VOUTMIN)ILOADMAX
= [(3.3 x 1.1) – (2.5 x .995)]275 x 10-3
= 314mW
Maximum allowable power dissipation:
In this example, the TC1268 dissipates a maximum of
314mW; below the allowable limit of 500mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 500mW into Equation 4-1, from
which VINMAX =3.94V.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(θJA)
2500 sq mm 2500 sq mm
2500 sq mm
60°C/W
1000 sq mm 2500 sq mm
2500 sq mm
60°C/W
225 sq mm
2500 sq mm
2500 sq mm
68°C/W
100 sq mm
2500 sq mm
2500 sq mm
74°C/W
Where:
PD ≈ (VINMAX –VOUTMIN)ILOADMAX
PD
VINMAX
VOUTMIN
ILOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PDMAX =(TJMAX –TAMAX)
θJA
Where all terms are previously defined.
PDMAX =(TJMAX –TAMAX)
θJA
= (125 – 95)
60
=500mW



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