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FUSB307B Datasheet(PDF) 3 Page - ON Semiconductor |
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FUSB307B Datasheet(HTML) 3 Page - ON Semiconductor |
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3 / 57 page ![]() FUSB307B www.onsemi.com 3 Table 1. ORDERING INFORMATION Part Number Operating Temperature Range Package Packing Method† FUSB307BMPX −40 to 85 °C 16–Lead Molded Leadless Package (QFN) JEDEC, ML220, 3 mm Square Tape and Reel FUSB307BVMPX Automotive −40 to 105 °C †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Typical Application Figure 2. FUSB307B Typical Mobile Computing Application CC2 CC1 INT_N SDA SCL Type−C receptacle FUSB307B GND VCONN VDD VBUS TCPM USB 2.0 & 3.1 Gen1 PHY USB Buck/Boost Charger + VBUS Buck + VCONN Buck Battery SNK VBAT V3P3 VCONN VSNK VSRC FPF2895 SRC I2C_ADDR_SEL/ ORIENT GPO1 GPU LDO VDD FPF2895 EN FUSB340 2:1 USB3.1 Switch GPO2 DEBUG_N 30 m Ω VOUT VIN ISET ON 1 μF 25 V 30 m Ω VIN VOUT 10 μF 10 μF 25 V 1 μF 10 μF 1 μF |
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