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www.protekdevices.com

05190.R1 9/03

EMIF6-100FC

FIGURE 5

RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.

FIGURE 6

SOLDER REFLOW PROFILE

225°C

5-10 sec

Instantaneous

to 200°C

Soldering

Time

Cool Down

Time

1-2 Minutes

to 150°C

1-2 Minutes to 25°C

Pre-Heat

Time

100°C

200°C

Note: This reflow profile does not take

into account the printed circuit board

(PCB) material heating time.

Additional time may be required for the

preheat time and cool down time upon

the PCB or board material.

APPLICATION INFORMATION

0.275mm

Round

Non-Solder Mask Defined Pads

0.325mm Round

0.150mm

0.330mm Round

50/50 By Volume

No Clean

OSP(Entek Cu Plus 106A)

±50µm

±20µm

60 Seconds

240°C

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Flux Ratio

Solder Paste Type

Pad Protective Finish

Tolerance - Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183°C)

Soldering Maximum Temperature

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE