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F72 Datasheet(PDF) 3 Page - AVX Corporation

Part # F72
Description  Low Profile and HiCV Conformal Coated Chip
PDF  4 Pages
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Manufacturer  AVX [AVX Corporation]
Direct Link  http://www.avx.com
Logo AVX - AVX Corporation

F72 Datasheet(HTML) 3 Page - AVX Corporation

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174
051718
F72/F75 Series
Low Profile and HiCV Conformal Coated Chip
TEST
F72/75 series (Temperature range -55ºC to +125ºC)
Condition
At 40°C, 90 to 95% R.H., 500 hours (No voltage applied)
Capacitance Change ........... Refer to page 173 (*1)
Dissipation Factor ................ Initial specified value or less
Leakage Current .................. Initial specified value or less
At -55°C / +125°C, 30 minutes each, 5 cycles
Capacitance Change ........... Refer to page 173 (*1)
Dissipation Factor ................ Initial specified value or less
Leakage Current .................. Initial specified value or less
10 seconds reflow at 260°C, 10 seconds immersion at 260°C.
Capacitance Change ........... Refer to page 173 (*1)
Dissipation Factor ................ Initial specified value or less
Leakage Current .................. Initial specified value or less
After application of surge voltage in series with a 33Ω resistor at the rate of 30 seconds ON, 30 seconds OFF,
for 1000 successive test cycles at 85ºC, capacitors shall meet the characteristic requirements in the table above.
Capacitance Change ........... Refer to page 173 (*1)
Dissipation Factor ................ Initial specified value or less
Leakage Current .................. Initial specified value or less
After 2000 hours’ application of rated voltage at 85°C,
capacitors shall meet the characteristic requirements in the table above.
Capacitance Change ........... Refer to page 173 (*1)
Dissipation Factor ................ Initial specified value or less
Leakage Current .................. Initial specified value or less
After applying the pressure load of 5N for 10±1 seconds horizontally to the center of capacitor side body
which has no electrode and has been soldered beforehand on a substrate, there shall be found neither
exfoliation nor its sign at the terminal electrode.
Keeping a capacitor surface-mounted on a substrate upside down and supporting the substrate at
both of the opposite bottom points 45mm apart from the center of capacitor, the pressure strength is
applied with a specified jig at the center of substrate so that the substrate may bend by 1mm as
illustrated. Then, there shall be found no remarkable abnormality on the capacitor terminals.
QUALIFICATION TABLE
Damp Heat
(Steady State)
Temperature Cycles
Resistance to
Soldering Heat
Surge
Endurance
Shear Test
Terminal Strength



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