SS120

Taiwan Semiconductor

2

Version:A1701

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance

28

°C/W

Junction-to-ambient thermal resistance

88

°C/W

Junction-to-case thermal resistance

30

°C/W

Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

0.82

0.95

V

0.65

0.85

V

(2)

-

0.1

mA

-

2.0

mA

Junction Capacitance

31

-

pF

Notes:

1.

Pulse test with PW=0.3 ms

2.

Pulse test with PW=30 ms

ORDERING INFORMATION

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX (*)

PACKAGE

PACKING

SS120

H

R3

G

SMA

1,800 / 7" Plastic reel

R2

7,500 / 13" Paper reel

M2

7,500 / 13" Plastic reel

*: Optional available

EXAMPLE

EXAMPLE P/N

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

DESCRIPTION

SS120HR3G

SS120

H

R3

G

AEC-Q101 qualified

Green compound