APX1690 datasheet(6/8 Pages) ANPEC

6 / 8 page

 ANPEC Electronics Corp.

Rev. A.3 - Dec., 2002

APX1690

www.anpec.com.tw

Physical Specifications

Reference JEDEC Standard J-STD-020A APRIL 1999

Reflow Condition (IR/Convection or VPR Reflow)

Pre-heat temperature

183 C

Peak temperature

Time

Classification Reflow Profiles

Convection or IR/

Convection

VPR

Average ramp-up rate(183

°C to Peak)

°C/second max.

°C /second max.

Preheat temperature 125 ± 25

°C)

120 seconds max

Temperature maintained above 183

°C

60 – 150 seconds

Time within 5

°C of actual peak temperature 10 –20 seconds

60 seconds

Peak temperature range

220 +5/-0

°C or 235 +5/-0°C 215-219°C or 235 +5/-0°C

Ramp-down rate

°C /second max.

Time 25

°C to peak temperature

6 minutes max.

Package Reflow Conditions

pkg. thickness

≥≥≥≥ 2.5mm

and all bgas

pkg. thickness < 2.5mm and

pkg. volume

≥≥≥≥ 350 mm³

pkg. thickness < 2.5mm and pkg.

volume < 350mm³

Convection 220 +5/-0

°C

Convection 235 +5/-0

°C

VPR 215-219

°C

VPR 235 +5/-0

°C

IR/Convection 220 +5/-0

°C

IR/Convection 235 +5/-0

°C

Terminal Material

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)

Lead Solderability

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

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