PAM2309

Document number: DSxxxxx Rev. 2 - 1

3 of 17

www.diodes.com

January 2013

© Diodes Incorporated

PAM2309

A Product Line of

Diodes Incorporated

These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may

affect device reliability. All voltages are with respect to ground.

Parameter

Rating

Unit

Input Voltage

-0.3 to +6.0

V

EN, FB Pin Voltage

V

SW Voltage

V

Junction Temperature

150

°C

Storage Temperature Range

-65 to +150

°C

Soldering Temperature

300, 5sec

°C

Parameter

Rating

Unit

Supply Voltage

2.5 to 5.5

V

Operation Temperature Range

-40 to +85

°C

Junction Temperature Range

-40 to +125

Thermal Information

Parameter

Package

Symbol

Max

Unit

Thermal Resistance (Junction to Case)

TSOT25 (Note 1)

130

°C/W

DFN2x2

20

QFN3x3

12

Thermal Resistance (Junction to Ambient)

TSOT25

102

DFN2x2

68

QFN3x3

34

Internal Power Dissipation

TSOT25

400

mW

DFN2x2

980

QFN3x3

1470

Note:

1. The maximun output current for TSOT25 package is limited by internal power dissipation capacity as described in

Application Information hereinafter.