AD840 datasheet(3/8 Pages) AD

3 / 8 page

NOTES

1Input offset voltage specifications are guaranteed after 5 minutes at T

A = +25°C.

2Full power bandwidth = slew rate/2

π V

PEAK.

3Refer to Figures 22 and 23.

4“S” grade T

MIN–TMAX specifications are tested with automatic test equipment at T A = –55°C and TA = +125°C.

All min and max specifications are guaranteed. Specifications shown in boldface are tested on all production units.

Specifications subject to change without notice.

AD840

REV. C

–3–

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Internal Power Dissipation

Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W

Cerdip (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W

LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W

Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±V

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .

±6 V

Storage Temperature Range

Q, E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65

°C to +150°C

N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65

°C to +125°C

Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +175

°C

Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300

°C

NOTES

1Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only, and functional

operation of the device at these or any other conditions above those indicated in

the operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

2Maximum internal power dissipation is specified so that T

J does not exceed

+175

°C at an ambient temperature of +25°C.

Thermal Characteristics:

Derate at

Cerdip Package

°C/W

110

°C/W

8.7 mW/

°C

Plastic Package

°C/W

100

°C/T

10 mW/

°C

LCC Package

°C/W

150

°C/W

6.7 mW/

°C

Recommended Heat Sink:

Aavid Engineering© #602B

ORDERING GUIDE

Models

Package Options

AD840JN

N-14

AD840KN

N-14

AD840JQ

Q-14

AD840KQ

Q-14

AD840SQ

Q-14

AD840SQ-883B

Q-14

5962-89640012A

Q-14

AD840SE-883B

E-20A

5962-8964001CA

E-20A

NOTES

1J and S Grade Chips also available.

2N = Plastic DIP; Q = Cerdip; E = LCC (Leadless

2Ceramic Chip Carrier).

Plastic DIP (N) Package

and

Cerdip (Q) Package

LCC (E) Package

AD840 Connection Diagrams

METALIZATION PHOTOGRAPH

Contact factory for latest dimensions.

Dimensions shown in inches and (mm).

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