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MCP6291, MCP6292, MCP6294

SBOS879C – JULY 2017 – REVISED JANUARY 2019

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Product Folder Links: MCP6291 MCP6292 MCP6294

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Copyright © 2017–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 3

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 7

7.1

Absolute Maximum Ratings ...................................... 7

7.2

ESD Ratings.............................................................. 7

7.3

Recommended Operating Conditions ....................... 7

7.4

Thermal Information: MCP6291 ................................ 7

7.5

Thermal Information: MCP6292 ................................ 8

7.6

Thermal Information: MCP6294 ................................ 8

7.7

(V+) – (V–) = 2.4 V to 5.5 V ....................................... 9

7.8

Typical Characteristics ............................................ 11

8

Detailed Description ............................................ 17

8.1

Overview ................................................................. 17

8.2

Functional Block Diagram ....................................... 17

8.3

Feature Description................................................. 18

8.4

Device Functional Modes........................................ 18

9

Application and Implementation ........................ 19

9.1

Application Information............................................ 19

9.2

Typical Application .................................................. 19

10

Power Supply Recommendations ..................... 21

10.1

Input and ESD Protection ..................................... 21

11

Layout................................................................... 22

11.1

Layout Guidelines ................................................. 22

11.2

Layout Example .................................................... 22

12

Device and Documentation Support ................. 23

12.1

Documentation Support ........................................ 23

12.2

Related Links ........................................................ 23

12.3

Receiving Notification of Documentation Updates 23

12.4

Community Resources.......................................... 23

12.5

Trademarks ........................................................... 23

12.6

Electrostatic Discharge Caution ............................ 23

12.7

Glossary ................................................................ 23

13

Mechanical, Packaging, and Orderable

Information ........................................................... 23

4 Revision History

Changes from Revision B (April 2018) to Revision C

Page

•

Deleted SOT-23 package preview notation in Device Information table................................................................................ 1

•

Added SC70 package to Device Information table................................................................................................................. 1

•

Added DCK package information to Device Comparison Table ........................................................................................... 3

•

Deleted DBV package preview notation from Pin Configuration and Functions section........................................................ 4

•

Added DCK package drawing and pin functions to Pin Configuration and Functions section ............................................... 4

•

Added DBV (SOT-23) and DCK (SC70) thermal information................................................................................................. 7

Changes from Revision A (October 2017) to Revision B

Page

•

Added DGK package to Thermal Information table .............................................................................................................. 8

Changes from Original (July 2017) to Revision A

Page

•

Deleted MCP6291 SC70, SOT-553, and SOIC packages from Device Information table ..................................................... 1

•

Deleted MCP6292 WSON and VSSOP (10) packages from Device Information table ......................................................... 1

•

Changed MCP6294 14-pin SOIC package from preview to production data in Device Information table ............................ 1

•

Deleted DCK, DRL, DSG, RTE and 8-pin D packages from Device Comparison table ....................................................... 3

•

Deleted DRL (SOT-533) package from MCP6291 pinout image and table in Pin Configuration and Functions section ..... 4

•

Deleted MCP6291 DCK (SC70) and D (SOIC) package pinout drawings and pin information from Pin Configuration

and Functions section............................................................................................................................................................. 4

•

Deleted MCP6292 DSG (WSON) and DGS (VSSOP) package pinout drawings and pin table information in Pin

Configuration and Functions section ..................................................................................................................................... 5

•

Deleted package preview note from MCP6294 pinout drawing in Pin Configuration and Functions section ....................... 6

•

Added MCP6294 Thermal Information table ......................................................................................................................... 8