ADP3418

Rev. B | Page 10 of 16

APPLICATION INFORMATION

SUPPLY CAPACITOR SELECTION

For the supply input (VCC) of the ADP3418, a local bypass

capacitor is recommended to reduce the noise and to supply

some of the peak currents drawn. Use a 4.7 µF, low ESR

capacitor. Multilayer ceramic chip (MLCC) capacitors provide

the best combination of low ESR and small size. Keep the

ceramic capacitor as close as possible to the ADP3418.

BOOTSTRAP CIRCUIT

a diode, as shown in Figure 1. These components can be

selected after the high-side MOSFET has been chosen. The

bootstrap capacitor must have a voltage rating that is able to

handle twice the maximum supply voltage. A minimum 50 V

rating is recommended. The capacitor values are determined

using the following equations:

GATE

GATE

BST2

BST1

V

Q

C

C

×

=

+

10

(1)

D

GATE

BST2

BST1

BST1

V

VCC

V

C

C

C

−

=

+

(2)

yields

D

GATE

BST1

V

VCC

Q

C

−

×

= 10

1

10

BST

GATE

GATE

BST2

C

V

Q

C

−

×

=

For example, an NTD60N02 has a total gate charge of about

capacitors should be used.

switch node. It also provides peak current limiting through D1.

needs to be able to handle at least 250 mW due to the peak

currents that flow through it.

A small-signal diode can be used for the bootstrap diode due to

diode must have a minimum 15 V rating to withstand the

maximum supply voltage. The average forward current can be

estimated by

MAX

GATE

AVG

F

f

Q

I

×

=

)

(

(3)

controller. The peak surge current rating should be calculated

using:

BST

D

PEAK

F

R

V

VCC

I

−

=

)

(

(4)

MOSFET SELECTION

When interfacing the ADP3418 to external MOSFETs, there are

a few considerations that the designer should be aware of. These

will help to make a more robust design that will minimize

stresses on both the driver and MOSFETs. These stresses

include exceeding the short-time duration voltage ratings on

the driver pins as well as the external MOSFET.

It is also highly recommended to use the Boot-Snap circuit to

improve the interaction of the driver with the characteristics of

the MOSFETs. If a simple bootstrap arrangement is used, make

sure to then include a proper snubber network on the SW node.

High-Side (Control) MOSFETs

The high-side MOSFET is usually selected to be high speed to

minimize switching losses (see any ADI Flex-mode™ controller

datasheet for more details on MOSFET losses). This usually

implies a low gate resistance and low input capacitance/charge

device. Yet, there is also a significant source lead inductance that

can exist (this depends mainly on the MOSFET package; it is

best to contact the MOSFET vendor for this information).

The ADP3418 DRVH output impedance and the input

resistance of the MOSFETs determine the rate of charge

delivery to the gate’s internal capacitance, which determines the

speed at which the MOSFETs turn on and off. However, due to

potentially large currents flowing in the MOSFETs at the on and

off times (this current is usually larger at turn off due to

ramping up of the output current in the output inductor), the

source lead inductance will generate a significant voltage across

it when the high-side MOSFETs switch off. This will create a

significant drain-source voltage spike across the internal die of

the MOSFETs and can lead to catastrophic avalanche. The

mechanisms involved in this avalanche condition can be

referenced in literature from the MOSFET suppliers.