12T06AFSW datasheet(6/7 Pages) NELLSEMI

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Fig.11 Relative variation of critical rate of decrease

of main current versus junction temperature

(dI/dt)c [T ] (dl/dt)c [T specified ]

T (°C)

100

125

Fig.12 D PAK thermal resistance junction to

ambient versus copper surface under

tab (printed circuit board FR4, copper

thickness: 35µm)

Rth(j-a)(°C/W)

D PAK

S(cm )

Case Style

2.87 (0.113)

2.62 (0.103)

9.40 (0.370)

9.14 (0.360)

10.54 (0.415) MAX.

16.13 (0.635)

15.87 (0.625)

4.06 (0.160)

3.56 (0.140)

1.45 (0.057)

1.14 (0.045)

2.67 (0.105)

2.41 (0.095)

2.65 (0.104)

2.45 (0.096)

5.20 (0.205)

4.95 (0.195)

0.90 (0.035)

0.70 (0.028)

3.91 (0.154)

3.74 (0.148)

4.70 (0.185)

4.44 (0.1754)

1.39 (0.055)

1.14 (0.045)

3.68 (0.145)

3.43 (0.135)

8.89 (0.350)

8.38 (0.330)

29.16 (1.148)

28.40 (1.118)

14.22 (0.560)

13.46 (0.530)

0.56 (0.022)

0.36 (0.014)

2.79 (0.110)

2.54 (0.100)

15.32 (0.603)

14.55 (0.573)

TO-220AB

TO-263(D PAK)

2.79 (0.110)

0.36 (0.014)

2.79 (0.110)

2.29 (0.090)

1.40 (0.055)

1.19 (0.047)

0 to 0.254 (0 to 0.01)

1.40 (0.055)

1.14 (0.045)

4.83 (0.190)

4.06 (0.160)

10.45 (0.411)

9.65 (0.380)

6.22 (0.245)

9.14 (0.360)

8.13 (0.320)

15.00 (0.591)

0.940 (0.037)

0.686 (0.027)

2.67 (0.105)

2.41 (0.095)

5.20 (0.205)

4.95 (0.195)

15.85 (0.624)

3.56 (0.140)

0.53 (0.021)

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