4

TMP117

SNOSD82A – JUNE 2018 – REVISED OCTOBER 2018

www.ti.com

Product Folder Links: TMP117

Submit Documentation Feedback

Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

Over free-air temperature range unless otherwise noted

(1)

MIN

MAX

UNIT

Supply voltage

V+

–0.3

6

V

Voltage at

SCL, SDA, ALERT and ADD0

–0.3

6

V

–55

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

V+

Supply voltage

1.8

3.3

5.5

V

SCL, SDA, ALERT and ADD0

0

5.5

V

Operating free-air temperature

–55

150

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

TMP117

UNIT

DRV (WSON)

6 PINS

Junction-to-ambient thermal resistance

70.7

°C/W

Junction-to-case (top) thermal resistance

82.3

°C/W

Junction-to-case (bottom) thermal resistance

11.7

°C/W

Junction-to-board thermal resistance

35.4

°C/W

Junction-to-top characterization parameter

2.2

°C/W

Junction-to-board characterization parameter

35.3

°C/W

Thermal Mass

5.1

mJ/°C