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Page 2 of 26

RFM75P V1.1

Table of Contents

1

General Description ................................................................................................................. 3

2

Abbreviations .......................................................................................................................... 4

3

Pin Information ....................................................................................................................... 5

4

State Control ........................................................................................................................... 6

4.1

State Control Diagram ......................................................................................................... 6

4.2

Power Down Mode............................................................................................................ 7

4.3

Standby-I Mode................................................................................................................. 7

4.4

Standby-II Mode.................................................................................................................. 7

4.5

TX Mode ............................................................................................................................. 7

4.6

RX Mode ............................................................................................................................. 8

5

Packet Processing ..................................................................................... ................................ 8

5.1

Packet Format..................................................................................................................... 8

5.1.1

Preamble.................................................................................................................... 9

5.1.2

Address....................................................................................................................... 9

5.1.3

Packet Control ............................................................................................................ 9

5.1.4

Payload ...................................................................................................................... 10

5.1.5

CRC............................................................................................................................. 10

5.2

Packet Handling .................................................................................................................. 10

6

Data and Control Interface ............................................................................ ............................ 11

6.1

TX/RX FIFO .......................................................................................................................... 11

6.2

Interrupt ............................................................................................................................. 11

6.3

SPI Interface ........................................................................................................................ 12

6.3.1

SPI Command ............................................................................................................. 12

6.3.2

SPI Timing ................................................................................................................... 13

7

Register Map .............................................................................................. ............................... 15

7.1

Register Bank 0 .................................................................................................................... 15

7.2

Register Bank 1 .................................................................................................................... 21

8

Electrical Specifications ................................................................................ ............................. 22

9

Typical Application Schematic..................................................................... .............................. 23

10

Package and Die Bonding Information........................................................ ............................... 24

10.1

Package Information ...................................................................................................... 24

10.2

Die Bonding Information ................................................................................................. 25

10.3

PCB Bonding diagram ..................................................................................................... 27

11

Order Information .......................................................................................... ........................... 28

12

Contact Information ..................................................................................... ............................. 29

13

Update History ............................................................................................ .............................. 30