DFP8140/60

Fully Automatic Polisher

Improved yield

Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160

effectively removes the grinding induced damage layer by utilizing a dry

polishing process. This process greatly reduces warpage and the chance of

wafer breakage while improving die strength. The end result is superior product

yield, even for today's ultrathin wafers.

In-line system

The DFP8140/8160‘s design allows it to be integrated with DISCO grinders for

an in-line wafer thinning solution that grinds, dry polishes, and transports

wafers safely and securely (the in-line system requires the installation of

optional accessories).

Chemical- and slurry-free stress relief

Environmentally friendly process

Unlike chemical etching or CMP, the dry polishing process does not

require costly waste treatment and disposal. Dry polishing with the

DFP8140/8160 is environmentally friendly while maintaining a lower

cost of ownership than other stress relief processes.

Easy operation

The DFP8140/8160 utilizes the same operator interface and machine

layout as the DISCO Fully Automatic Grinder (DFG8540/8560). This

ensures reduced training time for operators familiar with DISCO

equipment. For those new to the 8000 Series, the touch-screen

graphical user interface with real-time process data makes both

operation and maintenance tasks easy to learn and accomplish.

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DFP8160