Fully Automatic Polisher

DFP8140/8160

Specifications

Environmental conditions

• Use clean, oil-free air at a dew point of -15 ℃ or less. (Use a residual oil: 0.1 ppm Wt/Wt. Filtration rating: 0.01 μm/99.5 % or more).

• Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).

• Keep grinding water + 0 - 2 ℃ above room temperature (fluctuations within 1℃ over one hour) and cooling water between 20 ℃- 25 ℃ (fluctuations within 2℃ over one hour).

• Keep spindle cooling water temperature between 20 - 25 ℃ (fluctuations within 2 ℃ over an hour).

• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.

• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.

* All the pressures are described using gauge pressure.

* The above specifications may change due to technical modifications. Please confirm when placing your order.

* For further information please contact your local sales representatives.

2014.11

www.disco.co.jp

Unit

DFP8140

DFP8160

mm

φ 4"/5"/6"/8"

Select one size

φ 200/φ 300

Select one size

-

mm

φ 300

φ 450

-

-

min

-1

-

Output

kW

4.8

7.5

Revolution

speed range

min

-1

1,000 - 4,000

1,000 - 3,000

-

-

mm

1,200×2,670×1,800

1,400×3,322×1,800

kg

Approx.1,900

Approx.2,400

Spinner unit

2-stream jet nozzle cleaning

& both side drying

Machine weight

Machine dimensions

(W×D×H)

Specification

Anomalous In-feed grinding with wafer

rotation

Dry Polishing Wheel

Chuck table type

Water & air thrust up, Leveling stone and

brush cleaning

Chuck table cleaning

Polishing Method

Wafer Diameter

Thin force sensor

Porous chuck table

Chuck-method

Internal load sensor

Spindle

Vacuum

Number of revolutions

0 - 300