CMOS High Voltage Logic – CD4049UB

 

 

 

CMOS Hex Inverting Buffer / Converter in bare die form

Supply voltage range: 3V to 18V

Rev 1.0

18/09/18

Features:

Description

 

 

 

 

 

The CD4049UB features logic level conversion using

device is used for logic level conversion. This device

is intended for use as a CMOS to DTL/TTL converter

use where low power dissipation and/or high noise

immunity is desired. This part should be considered a

preferable replacement for CD4009UB or CD4010B in

any inverter, current driver, or logic level conversion

application due to its single power supply capability.

High Source and Sink Currents

High-to-Low Level Logic Conversion

High Sink Current for Driving x2 TTL Loads

Maximum Input Current: 1 µA at 18 V over full

temperature range

ESD protection diodes on all inputs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Die Size (Unsawn)

1524 x 1372

60 x 54

µm

mils

Minimum Bond Pad Size

106 x 106

4.17 x 4.17

µm

mils

Die Thickness

635 (±20)

25 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

The following part suffixes apply:

Ordering Information

Die Dimensions in µm (mils)

1524 (60)

No suffix - MIL-STD-883 /2010B Visual Inspection

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (100 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 635µm(25 Mils) – On request

Assembled into Ceramic Package – On request

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