V. Quality Assurance Information

A. Quality Assurance Contacts:

Jim Pedicord (Manager, Reliability Operations)

Bryan Preeshl (Executive Director)

Kenneth Huening (Vice President)

B. Outgoing Inspection Level:

0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135

°C biased (static) life test are shown in Table 1. Using these results, the Failure

Rate (

λ) is calculated as follows:

λ =

1

=

1.83

(Chi square value for MTTF upper limit)

MTTF

192 x 4389 x 160 x 2

Temperature Acceleration factor assuming an activation energy of 0.8eV

λ = 6.79 F.I.T. (60% confidence level @ 25°C)

This low failure rate represents data collected from Maxim’s reliability monitor program.

In addition to

routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects

it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be

shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece

sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In

Schematic (Spec. # 06-5630) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test

monitors. This data is published in the Product Reliability Report (RR-1M).

B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample

must meet an LTPD = 20 or less before shipment as standard product.

Additionally, the industry standard

85

°C/85%RH testing is done per generic device/package family once a quarter.

C. E.S.D. and Latch-Up Testing

The RF24-7 die type has been found to have all pins able to withstand a transient pulse of

±1500V, per Mil-

Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device

withstands a current of

±250mA.