PCF8813 datasheet(69/72 Pages) PHILIPS

69 / 72 page

2004 Mar 05

Philips Semiconductors

Product speciﬁcation

(67 + 1)

× 102 pixels matrix LCD driver

PCF8813

21 TRAY INFORMATION

handbook, full pagewidth

1,1

x,1

1,2

1,y

x,y

MGW798

SECTION A-A

Fig.58 Tray details.

Table 29 Tray dimensions

DIMS

DESCRIPTION

VALUE

pocket pitch; x direction

14.66 mm

pocket pitch; y direction

3.76 mm

pocket width; x direction

10.95 mm

pocket width; y direction

1.95 mm

tray width; x direction

50.8 mm

tray width; y direction

50.8 mm

distance from cut corner to pocket

(1, 1) centre

10.74 mm

distance from cut corner to pocket

(1, 1) centre

4.72 mm

tray thickness

3.96 mm

tray cross section

1.78 mm

tray cross section

2.44 mm

pocket depth

0.89 mm

number of pockets in x direction

number of pockets in y direction

handbook, halfpage

MGW799

Fig.59 Tray alignment.

The orientation of the IC in a pocket is indicated by the

position of the IC type name on the die surface with

respect to the chamfer on the upper left corner of the tray.

Refer to the bonding pad location diagram for the

orientating and position of the type name on the die

surface.

PCF8813 Datasheet(PDF) 69 Page - NXP Semiconductors

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