PCF8813 datasheet(2/72 Pages) PHILIPS

2 / 72 page

2004 Mar 05

Philips Semiconductors

Product speciﬁcation

(67 + 1)

× 102 pixels matrix LCD driver

PCF8813

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

7.1

I/O buffer and interface

7.2

Oscillator

7.3

Address counter

7.4

Display data RAM

7.5

Timing generator

7.6

Display address counter

7.7

LCD row and column drivers

7.8

LCD waveforms and DDRAM to data mapping

7.9

DDRAM addressing

7.10

Data order

7.11

Mirror X

7.12

Mirror Y

7.13

Bottom row swap

7.14

Output row order

PARALLEL INTERFACES

8.1

6800-type parallel interface

8.2

8080-type parallel interface

SERIAL INTERFACES

9.1

Serial peripheral interface

9.1.1

Write mode

9.1.2

Read mode

9.2

Serial interface (3-line)

9.2.1

Write mode

9.2.2

Read mode

I2C-BUS INTERFACE (Hs-MODE)

10.1

Characteristics of the I2C-bus (Hs-mode)

10.1.1

System configuration

10.1.2

Bit transfer

10.1.3

Start and stop conditions

10.1.4

Acknowledge

10.2

I2C-bus Hs-mode protocol

10.3

Command decoder

INSTRUCTIONS

11.1

Initialization

11.2

Reset function

11.3

Power-down mode

11.4

Display Control

11.5

Set Y address of RAM

11.6

Set X address of RAM

11.7

Set maximum X address or Y address

11.8

Set display start line, initial start row and row 0

11.9

Set normal or partial display mode

11.10

Free programmable multiplex rate

11.11

Set HV generator stages

11.12

Bias system

TEMPERATURE COMPENSATION

LIMITING VALUES

HANDLING

DC CHARACTERISTICS

AC CHARACTERISTICS

MODULE MAKER PROGRAMMING

17.1

LCD voltage calibration

17.2

Manufacturer identity

17.3

Seal bit

17.4

One time programming

17.4.1

Architecture

17.4.2

Operations

17.5

Interface commands

17.5.1

Disable OTP command

17.5.2

Module maker calibration

17.5.3

Refresh

17.6

Filling the shift register

17.7

Programming flow

17.8

Programming specification

17.9

Programming examples

APPLICATION INFORMATION

18.1

Protection from light

18.2

Application examples

18.3

Chip-on-glass applications

DEVICE PROTECTION DIAGRAM

BONDING PAD INFORMATION

TRAY INFORMATION

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

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