| Electronic Components Datasheet Search |
|
AD9929BBCZ Datasheet(PDF) 60 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
AD9929BBCZ Datasheet(HTML) 60 Page - Analog Devices |
|
60 / 64 page ![]() AD9929 Rev. A | Page 60 of 64 CIRCUIT LAYOUT INFORMATION The AD9929 typical circuit connection is shown in Figure 71. The PCB layout is critical in achieving good image quality from the AD9929 product. All of the supply pins must be decoupled to ground with good quality, high frequency chip capacitors. The 0.1 µF decoupling capacitors should be located as close as possible to the supply pins, and should have a very low induc- tance path to a continuous ground plane. There should also be a 4.7 µF or larger capacitor for each main supply, although it is not necessary for each individual pin. In most applications it is easier and recommended to share the same supply for AVDD, DVDD, TCVDD, RGVDD, and HVDD, as long as the individual supply pins are separately bypassed at each supply pin. A separate 3 V supply should be used for DRVDD with this supply pin decoupled to the same ground plane as the rest of the chip. A separate ground for DRVSS is not recommended. The vertical driver VM supply pins can be connected to indi- vidual supplies or to the same supply, depending on the appli- cation requirement for the mid-level voltage on the vertical outputs. These pins may also be directly connected to the common ground plane, as shown in Figure 71. The analog bypass pins, REFB, REFT, should also be carefully decoupled to ground as close as possible to their respective pins. The analog input, CCDIN, capacitor should also be located close to the pin. The H1, H2, and RG printed circuit board traces should be designed to have low inductance to avoid excessive distortion of the signals. Heavier traces are recommended because of the large transient current demand by the CCD on H1 and H2. If possible, physically locate the AD9929 close to the CCD to reduce the inductance on these lines. As always, the routing path should be as direct as possible from the AD9929 to the CCD. Careful trace impedance considerations must also be made with applications using a flex printed circuit (FPC) con- necting the CCD to the AD9929. FPC trace impedances can be controlled by applying a solid uniform ground plane under the H1, H2, and RG traces. This helps minimize the amount of overshoot and ringing on these signals at the CCD inputs. |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |