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AD9945KCPZ Datasheet(PDF) 14 Page - Analog Devices |
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AD9945KCPZ Datasheet(HTML) 14 Page - Analog Devices |
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14 / 14 page ![]() AD9945 Rev. C | Page 14 of 14 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-WHHD. 1 0.50 BSC BOTTOM VIEW TOP VIEW PIN 1 INDICATOR 32 9 16 17 24 25 8 EXPOSED PAD PIN 1 INDICATOR 3.25 3.10 SQ 2.95 SEATING PLANE 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 0.30 0.25 0.18 5.10 5.00 SQ 4.90 0.80 0.75 0.70 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.50 0.40 0.30 0.25 MIN Figure 12. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very Very Thin Quad (CP-32-7) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD9945KCPZ −20°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 AD9945KCPZRL7 −20°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 1 Z = RoHS Compliant Part. REVISION HISTORY 5/13—Rev. B to Rev. C Updated Outline Dimensions........................................................14 Changes to Ordering Guide...........................................................14 1/11—Rev. A to Rev. B Changed 140 mW to 160 mW Throughout ..................................1 Changes to Power Supply Voltage Parameter and Power Consumption, Normal Operation (DRVDD Power not Included) Parameter in General Specifications Table ..................2 Changed 2.7 V to 2.85 V in Digital Specifications Table Summary ............................................................................................2 Changes to System Specifications Table Summary.......................3 Added Low Gain Mode Parameter in System Specifications Table ....................................................................................................3 Added Exposed Pad Notation to Pin Configuration....................5 Changes to TPC 1..............................................................................7 Changes to Table 1 ............................................................................8 Changes to Figure 4 and Figure 5 ...................................................9 Added Required Start-Up Write Section .....................................13 Changes to Grounding and Decoupling Recommendations Section ..............................................................................................13 Moved Ordering Guide ..................................................................14 Changes to Ordering Guide...........................................................14 11/03—Rev. 0 to Rev. A Changes to Timing Specifications...................................................4 Changes to Ordering Guide.............................................................4 Changes to Figure 11 ......................................................................13 Updated Outline Dimensions........................................................14 ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03636-0-5/13(C) |
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