MPA4609

2

SBOS252D

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

MPA4609

TQFP-48

PFB

–40

°C to +85°C

MPA4609

MPA4609IPFBT

Tape and Reel, 250

"

"""

"

MPA4609IPFBR

Tape and Reel, 2000

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at

www.ti.com.

Power Supply ...................................................................................... +7V

Internal Power Dissipation ............................................................. 750mW

Differential Input Voltage ..................................................................

±1.2V

Storage Temperature Range: PFB ................................ –40

°C to +125°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

ESD Rating (Human Body Model) .................................................. 3000V

(Charge Device Model) ............................................... 1500V

(Machine Model) ........................................................... 200V

NOTES: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability.

Read

Amp

Output

Amp

Read

Amp

Read

Amp

Read

Amp

Read

Amp

Read

Amp

Read

Amp

Read

Amp

Output

Amp

Output

Amp

Output

Amp

Band Gap

Reference

Common-Mode

Reference

MPA4609

Forward

Reverse

A

A

B

B

C

D

A

A

B

B

C

C

D

D

A

A

B

B

C

C

D

D

+5V

V

CM

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

3k

Ω

V

CM

V

CM

V

CM

V

CM

V

CM

V

CM

V

CM

FWD/REV (Pin 3)

FWD/REV (Pin 34)

2.1V

V

CM

V

CM

V

CM

V

CM

V

CM

BLOCK DIAGRAM

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.