Electronic Components Datasheet Search
  English  ▼

X  

DS1543 Datasheet(PDF) 16 Page - Dallas Semiconductor

Part # DS1543
Description  64k NV Timekeeping RAM
PDF  17 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  DALLAS [Dallas Semiconductor]
Direct Link  https://www.maximintegrated.com/en.html
Logo DALLAS - Dallas Semiconductor

DS1543 Datasheet(HTML) 16 Page - Dallas Semiconductor

Back Button DS1543 Datasheet HTML 9Page - Dallas Semiconductor DS1543 Datasheet HTML 10Page - Dallas Semiconductor DS1543 Datasheet HTML 11Page - Dallas Semiconductor DS1543 Datasheet HTML 12Page - Dallas Semiconductor DS1543 Datasheet HTML 13Page - Dallas Semiconductor DS1543 Datasheet HTML 14Page - Dallas Semiconductor DS1543 Datasheet HTML 15Page - Dallas Semiconductor DS1543 Datasheet HTML 16Page - Dallas Semiconductor DS1543 Datasheet HTML 17Page - Dallas Semiconductor  
Zoom Inzoom in Zoom Outzoom out
 16 / 17 page
background image
DS1543
16 of 17
AC TEST CONDITIONS
Output Load:
100 pF + 1TTL Gate
Input Pulse Levels:
0.0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1. Voltage referenced to ground.
2. Typical values are at 25
°C and nominal supplies.
3. Outputs are open.
4. Battery switch over occurs at the lower of either the battery voltage or VPF.
5. The IRQ /FT and RST outputs are open-drain.
6. Data retention time is at 25
°C.
7. Each DS1543 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules as a cumulative time in the absence of VCC starting
from the time power is first applied by the user.
8. Real Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85
°C. Post-solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live - bug”).
b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the
part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to remove
solder.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com