RFASWR681CTF03 datasheet(13/15 Pages) WALSIN

13 / 15 page

Approval Sheet

Page 13 of 15

ASC_ RFASWR681CTF03_V11

Sep. 2017

Reliability test

TEST

PROCEDURE / TEST METHOD

REQUIREMENT

*Solderability

*JIS C 0050-4.6

*JESD22-B102D

*Solder bath temperature：255

 5C

*Immersion time：5

 0.5 sec

*Solder：Sn3Ag0.5Cu for lead-free

*At least 95% of a surface of each terminal

*electrode must be covered by fresh solder.

*High temperature

*JIS C 0021

*Temperature：90

C2C

*Test duration：1000+24/-0 hours

*Measurement to be made after keeping at

*room temperature for 24

2 hrs

*No mechanical damage.

*Electrical specification shall satisfy the

*descriptions in electrical characteristics

under *the operational temperature range

within -30 *~ 90°C.

*Low temperature

*JIS C 0020

*Temperature：-30

C2C

*Test duration：1000+24/-0 hours

*Measurement to be made after keeping at

*room temperature for 24

2 hrs

*No mechanical damage.

*Electrical specification shall satisfy the

*descriptions in electrical characteristics

under *the operational temperature range

within -30 *~ 90°C.

*Temperature cycle

*JIS C 0025

*1. 30

3 minutes at -303C,

*2. 10~15 minutes at room temperature,

*3. 30

3 minutes at +903C,

*4. 10~15 minutes at room temperature,

*Total 100 continuous cycles

*Measurement to be made after keeping at

*room temperature for 24

2 hrs

*No mechanical damage.

*Electrical specification shall satisfy the

*descriptions in electrical characteristics

under *the operational temperature range

within -30 *~ 90°C.

*High temperature operation

*life (HTOL)

*Temperature：90

C

*VDD = 4.8V

*Time：1000+24/-0 hrs.

*Measurement to be made after keeping at

*room temperature for 24

2 hrs

*No mechanical damage.

*Electrical specification shall satisfy the

*descriptions in electrical characteristics

under *the operational temperature range

within -30 *~ 90°C.

Soldering condition

Typical examples of soldering processes that provide reliable joints without any damage are given in Figure 11.

Figure 11. Infrared soldering profile

260

245

217

200

150

10 sec

Time

30 sec min.

60~150 sec

480 sec max. to Peak

max. ramp up rate = 3°C/s

max. ramp down rate = 6°C/s

For SnAgCu series solder paste

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