LM74A datasheet(2/12 Pages) NSC

2 / 12 page

Connection Diagram

LM74A

Bond Pad Layout

20017727

TOP VIEW

1.40mm x 1.57 mm (55 x 62 mils)

Bond Pad Mechanical Dimensions

Dimensions of bond pad coordinates are in millimeters.

Origin of coordinates: center of die.

X-Direction is in the longitudinal axis of the die.

Coordinates refer to center of Bond Pad.

Pin#

-0.569 mm

+0.585 mm

-0.537 mm

+0.314 mm

-0.569 mm

-0.554 mm

n/a

+0.537 mm

+0.277 mm

+0.569 mm

Back

Ordering Information

Order Number

NS Package

Number

Supply Voltage

Transport Media

LM74A-5 MDA

No Package, Die

4.5V to 5.5V

7k unit surftape tape-and-reel

LM74A-3 MDA

No Package, Die

3.0V to 3.6V

7k unit surftape tape-and-reel

Pin Descriptions

Label

Pin #

Function

Typical Connection

SI/O

Slave Input/Output - Serial bus bi-directional data

line. Shmitt trigger input.

From and to Controller

Slave Clock - Serial bus clock Shmitt trigger input

line.

From Controller

GND

Power Supply Ground

Ground

No Connection

Chip Select input.

From Controller

Positive Supply Voltage Input

DC Voltage from 4.5V to 5.5V for the

LM74A-5 and 3.0V to 3.6V for the LM74A-3.

Bypass with a 0.1 µF ceramic capacitor.

Back

(Backside)

Can go to GND connection

LM74A Datasheet(PDF) 2 Page - National Semiconductor (TI)

LM74A Datasheet(HTML) 2 Page - National Semiconductor (TI)

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