3.0 V to 5.5 V

R4

R2

C8

AMC3301

OUTP

OUTN

VDD

DCDCgnd

DCDChgnd

INP

INN

DCDCout

Diagnostics

Resonator

and

Driver

LDO

R3

R1

C2

LDOout

LDO

DCDCin

Rectifier

0.1 …F

HLDOout

GND

HLDOin

1 nF

1 …F

0.1 …F

1 nF

1 …F

1 nF

0.1 …F

C4

C3

C11

C12

C9

C10

C6

C5

I

HGND

C7

C1

16

AMC3301

SBAS917 – AUGUST 2019

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9 Power Supply Recommendations

The AMC3301 is powered from the low-side power supply (VDD) with a nominal value of 3.3 V (or 5 V) ± 10%. TI

recommends a low-ESR decoupling capacitor of 1 nF (C4 in Figure 11) placed as close as possible to the VDD

pin, followed by a 1-µF capacitor (C3) to filter this power-supply path.

The primary-side of the DC/DC converter is decoupled with low-ESR 0.1-µF capacitor (C11) positioned close to

the device between pins DCDCin and DCDCgnd. Use a combination of low-ESR, 100-nF capacitor (C12) placed

as close as possible to the DCDCout and DCDChgnd pins, followed by a 1-µFcapacitor (C10) for decoupling of

the secondary side. The secondary-side ground reference DCDChgnd and HGND pins are connected to one end

of the shunt resistor, that is also connected to the negative input (INN) of the device. If a four-pin shunt is used,

the device inputs are connected to the inner leads, while HGND and DCDChgnd are connected to one of the

outer leads of the shunt.

For the secondary-side LDO, use low-ESR capacitors of 1nF (C9), placed as close as possible to the HLDOin

pin and a combination of low-ESR 1-nF (C6) and 100-nF (C5) decoupling capacitors. Place C6 as close as

possible to the HLDOout pin.

See the Layout Guidelines section for the corresponding layout recommendation.

Figure 11. AMC3301 Power Supply Decoupling Scheme