Data Sheet G15965EJ2V0DS

9

µµµµPC3533, 3504

RECOMMENDED MOUNTING CONDITIONS

The following conditions must be met for mounting conditions of the

µPC3533, 3504.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under

different conditions.

Type of Through-hole Device

µµµµPC3533HF, 3504HF: MP-45G

Process

Conditions

Wave Soldering

(only to leads)

Solder temperature: 260°C or below,

Flow time: 10 seconds or less

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each pin).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that

the package body does not get jet soldered.