Custom MMIC

300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294

Visit us online at www.custommmic.com

ver 1.4 0119

Die Outline (all dimensions in microns)

Notes:

1. No connection required for unlabeled pads

2. Backside is RF and DC ground

3. Backside and bond pad metal: Gold

4. Die is 85 microns thick

5. DC bond pads (2, 4) are 100 x 100 microns

6. RF bond pads (1, 3) are 100 x 150 microns

Mechanical Information

CMD197

1-24 GHz Distributed Driver Amplifier

1

2

3

4

136.00

1290.50

2300.00

349.00

1600.50

1720.00

1024.50

818.50