 2017-2018 Microchip Technology Inc.

DS20005745B-page 17

DSC1103/23

6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

Y2

X2

1.90

2.90

MILLIMETERS

2.54 BSC

MIN

E

MAX

Contact Pad Length (X6)

Contact Pad Width (X6)

Y1

X1

1.35

1.50

Microchip Technology Drawing C04-3010A

NOM

6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]

12

6

C

Contact Pad Spacing

3.70

Contact Pad to Center Pad (X2)

G

0.20

Thermal Via Diameter (X6)

V

Thermal Via Pitch

EV

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

With 2.8x1.8 mm Exposed Pad

C

E

X1

Y1

X2

Y2

EV

EV

ØV

G

SILK SCREEN