Custom MMIC

300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294

Visit us online at www.custommmic.com

ver 1.2 0919

Die Outline (all dimensions in microns)

Notes:

1. No connection required for unlabeled pads

2. Backside is RF and DC ground

3. Backside and bond pad metal: Gold

4. Die is 100 microns thick

5. Bond pads 1, 2, 4 and 5 are 100 x 150 microns

6. Bond pads 3, 6 and 7 are 100 x 100 microns

Mechanical Information

CMD304

DC-67 GHz Distributed Driver Amplifier

1

2

3

4

6

7

5

80.00

667.50

817.50

992.50

1350.00

304.00

996.00

1150.00

350.00

525.00

735.00