For telephone interfacing (without batteries)

* The IC substrate should be connected to VDD in the PCB layout artwork.

HT1613C

Rev. 1.10

9

August 17, 2001

HDI

PO

0. 1 m F

327 68H z

DO C L O CK

47k W

HT 9 3 X X X Di a l e r

HF O

8/ 10- D i g i t L C D

C O M SEG

CO M

SEG C O M

30

2

13

1

805 0

1

28

2

29

3

30

4

31

5

32

6

33

7

34

8

35

9

36

10

37

11

38

12

39

13

40

14

41

15

42

16

43

17

44

18

45

19

46

20

47

21

48

22

49

23

50

24

51

25

52

26

53

27

54

H T 1613C

HF I

330 m F

10V

VS S

1A b r i dge

Ri n g

Ti p

A9 2

HF I

V DD

805 0

A4 2

5. 1V

10 M W

1 m F

TI M E R

1N 41 48 ´ 6

HK

HK S

33 0k W

27 0k W

22 0k W

10 0k W

47k W

20k W

10 0k W

2. 7k W

47k W

33k W

O ff- h o o k

On - h o o k

HDI

VS S

X1

X2

3. 58M H z

0. 1 m F

0. 02 m F