DLPC900ZPC datasheet(24/83 Pages) TI1

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DLPC900

DLPS037D – OCTOBER 2014 – REVISED MARCH 2019

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(1)

The number inside the parentheses for the I/O refers to the I/O type defined in Table 1.

(2)

Assumes minimum 1 m/s airflow.

(3)

Maximum thermal values assume max power of 4.76 W (total for controller).

(4)

Assume φJT equals 0.4°C/W.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted). The functional performance of the device specified in this

data sheet is achieved when operating the device by the Recommended Operating Conditions. No level of performance is

implied when operating the device above or below the Recommended Operating Conditions limits.

I/O (1)

MIN

NOM

MAX

UNIT

VDD33

3.3 V supply voltage, I/O

3.135

3.3

3.465

VDD18

1.8 V supply voltage, LVDSAVD and

DRAMVDD

1.71

1.8

1.89

VDDC

1.15 V supply voltage, Core logic

1.100

1.15

1.200

PLLD_VDD

1.8 V supply voltage, PLL analog

1.71

1.8

1.89

PLLM1_VDD

1.8 V supply voltage, PLL analog

1.71

1.8

1.89

PLLM2_VDD

1.8 V supply voltage, PLL analog

1.71

1.8

1.89

PLLS_VDD

1.15 V supply voltage, PLL analog

1.090

1.15

1.200

PLLD_VDD

1.15 V supply voltage, PLL digital

1.090

1.15

1.200

PLLM1_VDD

1.15 V supply voltage, PLL digital

1.090

1.15

1.200

PLLM2_VDD

1.15 V supply voltage, PLL digital

1.090

1.15

1.200

Input voltage

USB (9)

VDD33

OSC (10)

VDD33

3.3 V LVTTL (1, 2, 3, 4)

VDD33

3.3 V I2C (8)

VDD33

Output voltage

USB (8)

VDD33

3.3 V LVTTL (1, 2, 3, 4)

VDD33

3.3 V I2C (8)

VDD33

1.8 V LVDS (7)

VDD18

Operating ambient temperature range

See (2) and (3)

°C

Operating top-center case temperature

See (3) and (4)

109.16

°C

Operating junction temperature

111

°C

(1)

RθJC analysis assumptions: The heat generated in the chip flows into overmold (top side) and also into the package laminate (bottom

side) and then into PCB via package solder balls. Should be used for heat sink analysis only.

(2)

Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC defined

standard test PCB. This JEDEC test PCB is not necessarily representative of the DLPC900 PCB and thus the reported thermal

resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best

information available during the design phase to estimate thermal performance.

(3)

Example: (3.2 W) × (0.4 C/W)

≈ 1.28°C temperature rise.

6.4 Thermal Information

THERMAL METRIC

DLPC900

UNIT

ZPC (BGA)

516 PINS

RθJC

(1)

Junction-to-case thermal resistance

4.4

°C/W

RθJA at 0 m/s of forced airflow

(2)

Junction-to-air thermal resistance

14.4

°C/W

RθJA at 1 m/s of forced airflow

(2)

Junction-to-air thermal resistance

9.5

°C/W

RθJA at 2 m/s of forced airflow

(2)

Junction-to-air thermal resistance

9.0

°C/W

φJT

(3)

Temperature variance from junction to package top center

temperature, per unit power dissipation

0.4

°C/W

DLPC900ZPC Datasheet(PDF) 24 Page - Texas Instruments

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