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LM124A Datasheet(PDF) 1 Page - Silicon Supplies

Part # LM124A
Description  Quad Operational Amplifier
PDF  6 Pages
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Manufacturer  SS [Silicon Supplies]
Direct Link  https://siliconsupplies.com/
Logo SS - Silicon Supplies

LM124A Datasheet(HTML) 1 Page - Silicon Supplies

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Quad Operational Amplifier – LM124A
 
Low power, Quad Operational Amplifier in bare die form
Rev 1.0
16/06/18
Features:
 
Description
 
Temperature compensated bandwidth (unity gain)
 
 
 
 
The LM124A consists of x4 independent, frequency
compensated operational amplifiers specifically
designed to operate from a single power supply over a
wide input voltage range. Input common-mode voltage
range includes ground and output voltage can also
swing to ground. Unity gain crossover frequency and
input bias current are temperature-compensated to
provide high stability. Split-supply operation is also
possible with supply current drain independent of
voltage supplied for low power consumption. The
device operates over the military temperature range.
Temperature compensated IB(MAX): 100nA
Wide power supply range, single supply: 3V-32V
or dual supplies: ±1.5V to ±16V
Low VOS: 1mV, and IOS : 2nA
Differential input voltage range equal to the power
supply voltage
Large output voltage: 0V to VCC -1.5V swing
Input Common-Mode Voltage range includes GND
 
 
 
Ordering Information
Die Dimensions in µm (mils)
The following part suffixes apply:
1270 (50)
 
No suffix - MIL-STD-883 /2010B Visual Inspection
 
 
“H” - MIL-STD-883 /2010B Visual Inspection
+ MIL-PRF-38534 Class H LAT
 
“K” - MIL-STD-883 /2010A Visual Inspection (Space)
+ MIL-PRF-38534 Class K LAT
 
LAT = Lot Acceptance Test.
 
For further information on LAT process flows see below.
 
www.siliconsupplies.com\quality\bare-die-lot-qualification
 
 
 
Supply Formats:
Mechanical Specification
 
Default – Die in Waffle Pack (400 per tray capacity)
Die Size (Unsawn)
1270 x 1200
µm
50 x 47
mils
 
Sawn Wafer on Tape – On request
90 x 90
µm
Minimum Bond Pad Size
3.54 x 3.54
mils
Unsawn Wafer – On request
280 (±10)
µm
 
Die Thickness
 
11.02 (±0.39)
mils
Die Thickness <> 280µm(11 Mils) – On request
Top Metal Composition
Al
Assembled into Ceramic Package – On request
Back Metal Composition
N/A – Bare Si
Page 1 of 6 
www.siliconsupplies.com


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