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830 Datasheet(PDF) 1 Page - Jiangsu Donghai Semiconductor Technology Co.,Ltd |
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830 Datasheet(HTML) 1 Page - Jiangsu Donghai Semiconductor Technology Co.,Ltd |
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1 / 12 page ![]() Jiangsu Donghai Semiconductor Technology CO.,LTD. Rev. 1.0 Page 1 of 12 830/F830/I830/ E830/B830/D830 5A 500V N-channel Enhancement Mode Power MOSFET 4 Electrical Characteristics 4.1 Absolute Maximum Rating(Tc=25℃,unless otherwise noted) Parameter Symbol Rating Units 830/I830/E830/ B830/D830 F830 Drian-to-Source Voltage VDSS 500 V Gate-to-Source Voltage VGSS ±30 V Continuous Drain Current TC=25℃ ID 5 A TC=100℃ 3.4 A Pulsed Drain Current(1) IDM 20 A Single Pulse Avalanche Energy(4) EAS 200 mJ Repetitive Avalanche Energy(4) EAR 30 mJ Repetitive Avalanche Current(4) IAR 2.5 A Peak Diode Recovery dv/dt(5) dv/dt 5 V/ns Power Dissipation Ta=25℃ Ptot 2.0 2.0 W TC=25℃ Ptot 75 30 W Gate-Source ESD (HBM-C=100pF,R=1.5KΩ) VESD(G-S) 3000 V Isolation Voltage VISO / 2500 V Junction Temperature Range Tj -55~150 ℃ Storage Temperature Range Tstg -55~150 ℃ Maximum Temperature for soldering TL 300 ℃ 4.2 Thermal Characteristics Parameter Symbol Rating Unit 830/I830/E830/ B830/D830 F830 Thermal Resistance,Junction to Case-sink RthJC 1.67 4.17 ℃ /W Thermal Resistance,Junction to Ambient RthJA 62.5 62.5 ℃ /W 1 Description 830, the silicon N-channel enhanced vdmosfets, is obtained by the self-aligned planar technology which reduce the conduction loss, improve switching performance and enhance the avalanche energy. Which accords with the RoHS standard. 2 Features ● Fast switching ● ESD improved capability ● Low gate charge(Typ: 14.5nC) ● Low reverse transfer capacitances(Typ: 7.5pF) ● 100% single pulse avalanche energy test ● 100% ΔVDS test 3 Applications ● Used in various power switching circuit for system miniaturization and higher efficiency. ● Power switch circuit of adaptor and charger. VDSS = 500V RDS(on) (TYP)= 1.25Ω ID = 5A TO-220C TO-220F TO-262 TO-263 TO-252B TO-251B |
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