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SL2S1502 Datasheet(PDF) 10 Page - NXP Semiconductors

Part # SL2S1502
Description  ICODE ILT
PDF  33 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

SL2S1502 Datasheet(HTML) 10 Page - NXP Semiconductors

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NXP Semiconductors
SL2S1402_SL2S1502_SL2S1602
ICODE ILT
SL2S1402_SL2S1502_SL2S1602
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product data sheet
Rev. 3.3 — 15 October 2019
COMPANY PUBLIC
234333
10 / 33
Type
sandwich structure
Material
PE-nitride (on top)
Thickness
1.75 μm total thickness of passivation
Au bump
Material
>99.9 % pure Au
Hardness
35 HV to 80 HV 0.005
Shear strength
>70 MPa
Height
18 μm
Height uniformity
within a die
±2 μm
within a wafer
±3 μm
wafer to wafer
±4 μm
Bump flatness
±1.5 μm
Bump size
LA, LB
60 μm × 60 μm
TEST, GND
60 μm × 60 μm
variation
±5 μm
Under bump metallization
sputtered TiW
8.1.1 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 13 "General specification for 8" wafer on UV-tape with electronic fail die
marking"
8.1.2 Map file distribution
See Ref. 13 "General specification for 8" wafer on UV-tape with electronic fail die
marking".



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