KMI17_4

All information provided in this document is subject to legal disclaimers.

© NXP Semiconductors N.V. 2014. All rights reserved.

Product data sheet

Rev. 1 — 1 September 2014

13 of 16

NXP Semiconductors

KMI17/4

Rotational speed sensor

15. Handling information

16. Solderability information

Recommended soldering process for leaded devices is wave soldering. The maximum

soldering temperature is 260

C for maximum 5 s.

17. Revision history

Dimensions in mm

(1) No bending allowed.

(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.

Fig 10. Bending recommendation

Table 7.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

KMI17_4 v.1

20140901

Product data sheet

-

-