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LM4132 Datasheet(PDF) 12 Page - National Semiconductor (TI) |
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LM4132 Datasheet(HTML) 12 Page - National Semiconductor (TI) |
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12 / 15 page ![]() Application Information (Continued) T D = Temperature drift V REF = Nominal preset output voltage V REF_MIN = Minimum output voltage over operating temperature range V REF_MAX = Maximum output voltage over operating temperature range ∆T = Operating temperature range. The LM4132 features a low temperature drift of 10ppm (max) to 30ppm (max), depending on the grade. LONG TERM STABILITY Long-term stability refers to the fluctuation in output voltage over a long period of time (1000 hours). The LM4132 fea- tures a typical long-term stability of 50ppm over 1000 hours. The measurements are made using 5 units of each voltage option, at a nominal input voltage (5V), with no load, at room temperature. EXPRESSION OF ELECTRICAL CHARACTERISTICS Electrical characteristics are typically expressed in mV, ppm, or a percentage of the nominal value. Depending on the application, one expression may be more useful than the other. To convert one quantity to the other one may apply the following: ppm to mV error in output voltage: Where: V REF is in volts (V) and VERROR is in milli-volts (mV). Bit error (1 bit) to voltage error (mV): V REF is in volts (V), VERROR is in milli-volts (mV), and n is the number of bits. mV to ppm error in output voltage: Where: V REF is in volts (V) and VERROR is in milli-volts (mV). Voltage error (mV) to percentage error (percent): Where: V REF is in volts (V) and VERROR is in milli-volts (mV). PRINTED CIRCUIT BOARD and LAYOUT CONSIDERATIONS References in SOT packages are generally less prone to PC board mounting than devices in Small Outline (SOIC) pack- ages. To minimize the mechanical stress due to PC board mounting that can cause the output voltage to shift from its initial value, mount the reference on a low flex area of the PC board, such as near the edge or a corner. The part may be isolated mechanically by cutting a U shape slot on the PCB for mounting the device. This approach also provides some thermal isolation from the rest of the circuit. Bypass capacitors must be mounted close to the part. Mounting bypass capacitors close to the part will reduce the parasitic trace components thereby improving performance. www.national.com 12 |
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