VN2210

DS20005559A-page 10

 2016 Microchip Technology Inc.

3-Lead TO-92 Package Outline (L/LL/N3)

Symbol

A

b

c

D

E

E1

e

e1

L

Dimensions

(inches)

MIN

.170

.014

†

.014

†

.175

.125

.080

.095

.045

.500

NOM

---------

MAX

.210

.022

†

.022

†

.205

.165

.105

.105

.055

.610*

JEDEC Registration TO-92.

* This dimension is not specified in the JEDEC drawing.

† This dimension differs from the JEDEC drawing.

Drawings not to scale.

St

D

# DSPD 3TO92N3 V

i

E041009

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.