2

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2013

Absolute Maximum Ratings:

Parameter

Symbol

Absolute Maximum

Max Input Power

+30dBm

Control Voltage

+5V

Operating Temperature

-40°C to +100°C

Storage Temperature

-55°C to +150°C

Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the

device.

Truth Table:

Note:

‘High’

= >2.5V & <5V

‘Low’

= <0.2V

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size (

µm)

Die Thickness

(

µm)

Min. Bond Pad

Pitch (

µm)

Min. Bond pad

Opening (

µm)

870 x 970

150

141

94 x 94

RFIN-RF01

RFIN-RF02

High

Low

On

Off

Low

High

Off

On

Pad

Reference

Pad

Name

Description

Pin Coordinates

(

µm)

A

G1

GND1

159 , 286

B

RFI

RFIN

159 , 446

C

C2

Vctrl1

159 , 606

D

C1

Vctrl2

159 , 766

E

RFO1

RFO1

757 , 857

F

G2

GND2

757 , 555

G

G3

GND3

757 , 414

H

RFO2

RFO2

757 , 112

A

B

C

D

E

F

G

H