LND150 datasheet(3/16 Pages) MICROCHIP

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AC ELECTRICAL CHARACTERISTICS

Electrical Specifications: TA = 25°C unless otherwise specified. Specification is obtained by characterization and is

not 100% tested.

Parameter

Sym. Min. Typ. Max.

Unit

Conditions

Forward Transconductance

GFS

—

mmho VDS = 0V, ID = 1 mA

Input Capacitance

CISS

—

7.5

VGS = –10V,

VDS = 25V,

f = 1 MHz

Common Source Output Capacitance

COSS

—

3.5

Reverse Transfer Capacitance

CRSS

—

0.5

Turn-On Delay Time

td(ON)

—

0.09

—

VDD = 25V,

ID = 1 mA,

RGEN = 25Ω

Rise Time

—

0.45

—

Turn-Off Delay Time

td(OFF) —

0.1

—

Fall Time

—

1.3

—

DIODE PARAMETER

Diode Forward Voltage Drop

VSD

—

0.9

VGS = –10V, ISD = 1 mA (Note 1)

Reverse Recovery Time

trr

—

200

—

VGS = –10V, ISD = 1 mA

Note 1: Unless otherwise stated, all DC parameters are 100% tested at +25°C. Pulse test: 300 µs pulse, 2% duty

cycle.

TEMPERATURE SPECIFICATIONS

Parameter

Sym.

Min.

Typ. Max.

Unit

Conditions

TEMPERATURE RANGE

Operating Ambient Temperature

–55

—

+150

°C

Storage Temperature

–55

—

+150

°C

PACKAGE THERMAL RESISTANCE

3-lead TO-92

JA

—

132

—

°C/W

3-lead SOT-23

JA

—

203

—

°C/W

3-lead SOT-89

JA

—

133

—

°C/W

THERMAL CHARACTERISTICS

Package

ID (Note 1)

(Continuous)

(mA)

(Pulsed)

(A)

Power Dissipation

at TA = 25°C

(W)

IDR

(mA)

IDRM

(Note 1)

(A)

3-lead TO-92

0.74

3-lead SOT-23

0.36

3-lead SOT-89

1.6 (Note 2)

Note 1: ID (continuous) is limited by maximum rated TJ.

2: TA = 25°C. Mounted on an FR4 Board, 25 mm x 25 mm x 1.57 mm.

 2018 Microchip Technology Inc.

DS20005454A-page 3

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