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LP1115AQVF Datasheet(PDF) 7 Page - Lowpower Semiconductor inc |
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LP1115AQVF Datasheet(HTML) 7 Page - Lowpower Semiconductor inc |
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7 / 10 page ![]() LP1115-01 Dec.-2019 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 7 of 10 Preliminary Datasheet LP1115 Operation Information (Full Bridge Driver) The Full Bridge Driver part of LP1115 is a single phase MOSFET driver for driving two N-channel MOSFETs in a synchronous buck converter topology. The LP1115 will operate from 5V or 12V, but have been optimized for high current multi-phase buck regulators that convert 12V rail directly to the core voltage required by complex logic chips. A single PWM input signal is all that is required to properly drive the high-side and the low-side MOSFETs. Each driver is capable of driving a 3nF load at frequencies up to 1 MHz. High-Side Driver The high−side driver is designed to drive a floating low RDS(ON) N-channel MOSFET. The gate voltage for the high side driver is developed by a bootstrap circuit referenced to Switch Node (SW) pin. The bootstrap circuit is comprised of an external diode, and an external bootstrap capacitor. When the LP1115 are starting up, the SW pin is at ground, so the bootstrap capacitor will charge up to VCC through the bootstrap diode. When the PWM input goes high, the high-side driver will begin to turn on the high-side MOSFET using the stored charge of the bootstrap capacitor. As the high-side MOSFET turns on, the SW pin will rise. When the high-side MOSFET is fully on, the switch node will be at 12V, and the BST pin will be at 12V plus the charge of the bootstrap capacitor (approaching 24V).The bootstrap capacitor is recharged when the switch node goes low during the next cycle. Low-Side Driver The low-side driver is designed to drive a ground- referenced low RDS(ON) N-Channel MOSFET. The voltage rail for the low-side driver is internally connected to the VCC supply and GND. Safety Timer and Overlap Protection Circuit It is very important that MOSFETs in a synchronous buck regulator do not both conduct at the same time. Excessive shoot-through or cross conduction can damage the MOSFETs, and even a small amount of cross conduction will cause a decrease in the power conversion efficiency. The LP1115 prevent cross conduction by monitoring the status of the external MOSFETs and applying the appropriate amount of “ dead-time ” or the time between the turn off of one MOSFET and the turn on of the other MOSFET. When the PWM input pin goes high, DRVL will go low after a propagation delay (TpdlDRVL). The time it takes for the low-side MOSFET to turn off (TfDRVL) is dependent on the total charge on the low-side MOSFET gate. The LP1115 monitor the gate voltage of both MOSFETs and the switch node voltage to determine the conduction status of the MOSFETs. Once the low − side MOSFET is turned off an internal timer will delay (TpdhDRVH) the turn on of the high-side MOSFET. Likewise, when the PWM input pin goes low, DRVH will go low after the propagation delay (TpdlDRVH). The time to turn off the high-side MOSFET (TfDRVH) is dependent on the total gate charge of the high−side MOSFET. A timer will be triggered once the high-side MOSFET has stopped conducting, to delay (TpdhDRVL) the turn on of the low-side MOSFET. |
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