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ASTM1356 Datasheet(PDF) 2 Page - 3M Electronics

Part # ASTM1356
Description  3M™ Thermally Conductive Epoxy Adhesive TC-2707
PDF  4 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

ASTM1356 Datasheet(HTML) 2 Page - 3M Electronics

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3M™ Thermally Conductive Epoxy TC-2707
1. Bond Strength
2. Thermal Resistance
A typical suggested bond line is in the 3-7 mil (0.076- 0.018mm) thickness range,
For improved thermal performance (lower Thermal Resistance), a thinner bond line is suggested. A thinner bond line
can reduce the bond strength, so each application needs to be tested to find correct balance
Bond Line Thickness vs Thermal Resistance vs Bond Strength
A “fillet” at the edge of a bond line is suggested to increase bond strength. The fillets are formed as the epoxy squeezes
out past the side edges. Fillets can add strength to the assembly.
3™ Thermal Conductive Epoxy TC-2707 is supplied in dual syringe plastic duo-pak cartridges as part of the 3™ EPX™
Plus II Applicator System. The duo-pak cartridges are supplied in a 37 or 50 ml configuration. To use the cartridge
simply insert the duo-pak cartridge into the EPX applicator and start the plunger into the cylinders using light pressure
on the trigger. Next, remove the duo-pak cartridge cap and expel and discard a small amount of adhesive to be sure
both sides of the duo-pak cartridge are flowing evenly and freely (i.e.: no voids, “plugs of adhesive”, dis-continuity in
flow, etc.) Once even side to side and uniform flow from both sides of the duo-pak is confirmed, attach the 3M EPX
mixing nozzle to the duo-pak cartridge to ensure proper and uniform mixing of the Part A and Part B and begin
dispensing the adhesive.
Partially used cartridges must follow the above use instructions to ensure consistent product performance.
Complete and uniform mixing as noted above of the two components is required to obtain consistent product
performance.
3M™ EPX™ Plus II Applicator Mix Nozzles
Use only 3M™ EPX™ Plus II Applicator and Mix Nozzles to ensure optimum product performance.
Typical Cured Physical Properties and Performance Characteristics
Note:
The following technical information and data should be considered representative or typical only and should not be used for
specification purposes. Final product specifications and testing methods will be outlined in the products Certificate of Analysis
(COA) that is shipped with the commercialized product once it is approved by 3M for general commercialization and development
work is completed.
3M™ Thermally Conductive Epoxy Adhesive TC-2707
Property
Method*
Value
Color
Gray
Shore D Hardness
ASTM D2240
80
Glass Transition Temperature
ASTM 1356
See Chart on page 3
Thermal Coefficient of Expansion
ASTM E831
75 X 10 -6C (below Tag)
160 X10 -6/C (above Tg)
Thermal Conductivity
ASTM D5470
0.72 W/m-K
Thermal Impedance
ASTM D5470
3.51X 10-5 m°K/W (1 mil)



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