5 Pin Configuration and Functions

1

VFB

8

VIN

2

VREF

7

PD

3

VS+

6

VS-

4

VOUT+

5

VOUT-

Not to scale

Figure 5-1. D Package 8-Pin SOIC Top View

VFB

8

VIN

VREF

7

PD

VS+

6

VS-

VOUT+

5

VOUT-

Not to scale

2

1

3

4

Figure 5-2. DTK Package 8-Pin WSON Top View

Pin Functions

PIN(1)

TYPE(2)

DESCRIPTION

NAME

NO.

PD

7

I

Power down (low = enable, high = disable), cannot be floated

VFB

1

I

Amplifier 1 inverting (feedback) input

VIN

8

I

Amplifier 1 noninverting (signal) input

VOUT+

4

O

Noninverting output

VOUT–

5

O

Inverting output

VREF

2

I

Amplifier 2 noninverting (reference) input

VS+

3

P

Positive power supply

VS–

6

P

Negative power supply

(1)

Solder the exposed DTK package thermal pad to a heatspreading power or ground plane. This pad is electrically isolated from the die,

but must be connected to a power or ground plane and not floated.

(2)

I = input, O = output, and P = power.

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OPA862

SBOS919C – AUGUST 2019 – REVISED AUGUST 2020

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