Copyright © Future Technology Devices International Limited

4

FT602Q IC Datasheet

Version 1.4

Document No.: FT001389

Clearance No.: FTDI#519

Table of Contents

1

Typical Applications............................................................2

1.1 Driver Support ................................................................................ 2

1.2 Ordering Information...................................................................... 2

1.3 USB Compliance .............................................................................. 2

2

Block Diagram ....................................................................3

3

Device Pin Out and Signal Description................................6

3.1 Device Pin Out ................................................................................ 6

3.2 Device Pin Out Signal Description ................................................... 6

4

Function Description ........................................................10

4.1 Key Features and Function Description ......................................... 10

4.2 Multi-Channel FIFO mode Protocols .............................................. 11

4.3 245 Synchronous FIFO mode Protocols......................................... 13

4.4 FIFO Bus AC Timing ...................................................................... 13

4.5 Crystal Requirements.................................................................... 14

4.6 I2C Interface ................................................................................. 14

5

Devices Characteristics and Ratings .................................15

5.1 Absolute Maximum Ratings........................................................... 15

5.2 ESD and Latch-up Specifications ................................................... 15

5.3 DC Characteristics......................................................................... 16

5.3.1 DC Characteristics (Ambient Temperature = -40°C to +85°C) ........................... 16

5.3.2 DC Characteristics for I/O Interface ................................................................ 17

6

USB Power Configurations................................................18

6.1 USB Bus-Powered Configuration .................................................. 18

6.2 Self-Powered Configuration .......................................................... 19

7

Application Example .........................................................20

7.1 FT602 Connect to FIFO Master Interface ...................................... 20

8

Package Parameters.........................................................22

8.1 QFN-76 Package Mechanical Dimensions ...................................... 22

8.2 QFN-76 Package Markings ............................................................ 23

8.3 Solder Reflow Profile .................................................................... 24