NXP Semiconductors

FS6500, FS4500

Safety Power System Basis Chip with CAN FD and LIN Transceivers

FS6500-FS4500SDS

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© NXP B.V. 2017. All rights reserved.

Short data sheet: advance information

Rev. 1.0 — 14 December 2017

12 / 20

9 Packaging

9.1 Package mechanical dimensions

Package dimensions are provided in package drawings. To find the most current

package outline drawing, go to www.nxp.com and perform a keyword search for the

drawing's document number.

Table 5. Package mechanical dimensions

Package

Suffix

Package outline drawing number

7.0 × 7.0, 48–Pin LQFP exposed pad,

with 0.5 mm pitch, and a 4.5 × 4.5

exposed pad

AE

98ASA00173D