© Koninklijke Philips Electronics N.V. 2002.

Printed in the U.S.A

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner.

The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No

liability will be accepted by the publisher for any consequence of its use. Publication

thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 14 May 2002

Document order number: 9397 750 09791

Contents

Philips Semiconductors

PCK351

1:10 clock distribution device with 3-State outputs

1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

4

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

5

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

5.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

Functional description . . . . . . . . . . . . . . . . . . . 4

6.1

Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Logic symbol. . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.3

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

8

Recommended operating conditions. . . . . . . . 6

9

Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

10

Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

10.1

AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 9

11

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

12

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

12.1

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

12.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14

12.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14

12.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15

12.5

Package related soldering information . . . . . . 15

13

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15

14

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16

15

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16